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SUP90P06-09L
Vishay Siliconix
THERMAL RATINGS
200
150
100
1000
100
10
Limited by R DS(on) *
10 μs
100 μs
1 ms
50
Limited
by Package
1
T C = 25 °C
10 ms
100 ms, DC
Single Pulse
0
0.1
0
25
50
75
100
125
150
175
0.1
1 10 100
2
T C - Case Temperature (°C)
Maximum Avalanche and Drain Current
vs. Case Temperature
V DS - Drain-to-Source Voltage (V)
* V GS > minimum V GS at which R DS(on) is specified
Safe Operating Area
1
Duty Cycle = 0.5
0.2
Notes:
0.1
P DM
t 1
0.1
0.05
0.02
Single Pulse
t 1
t 2
1. Duty Cycle, D =
t 2
2. Per Unit Base = R thJA = 62.5 °C/W
3. T JM - T A = P DM Z thJA(t)
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73010 .
Document Number: 73010
S10-2545-Rev. B, 08-Nov-10
www.vishay.com
5
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